Invention Grant
- Patent Title: Frame and electronic frame
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Application No.: US16959399Application Date: 2019-09-26
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Publication No.: US11272635B2Publication Date: 2022-03-08
- Inventor: Jinggang Wei , Lei Cao , Ken Wen , Long Yang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: McDermott Will & Emery LLP
- Priority: CN201821824991.5 20181106
- International Application: PCT/CN2019/108205 WO 20190926
- International Announcement: WO2020/093810 WO 20200514
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K5/00 ; H05K5/02

Abstract:
A frame includes a first frame, a back case and a second frame. The first frame includes a first frame plate and a first frame wall, the back case includes a back case plate and a back case wall, the second frame includes a second frame plate and a second frame wall, and the second frame surrounds the first frame and the back case. The second frame plate is located on a side of the first frame plate facing away from the back case plate, and the first frame wall is protruded from a surface of the first frame plate facing towards the back case plate, the back case wall is protruded from a surface of the back case plate facing towards the first frame plate, and the second frame wall is protruded from a surface of the second frame plate facing towards the first frame plate.
Public/Granted literature
- US20200337172A1 FRAME AND ELECTRONIC FRAME Public/Granted day:2020-10-22
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