Invention Grant
- Patent Title: Heating tool
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Application No.: US16451403Application Date: 2019-06-25
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Publication No.: US11273509B2Publication Date: 2022-03-15
- Inventor: Kenji Matsuzaki , Kenta Nakamura
- Applicant: Hakko Corporation
- Applicant Address: JP Osaka
- Assignee: Hakko Corporation
- Current Assignee: Hakko Corporation
- Current Assignee Address: JP Osaka
- Agent David B Abel
- Main IPC: B23K3/00
- IPC: B23K3/00 ; B23K3/02 ; B23K3/03
Abstract:
A heating tool having a temperature sensor fixed within a tip of the heating tool with maximum heat conductivity to the temperature sensor.
Public/Granted literature
- US20200030902A1 HEATING TOOL Public/Granted day:2020-01-30
Information query
