Invention Grant
- Patent Title: Polyamide resin composition and article comprising the same
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Application No.: US16687926Application Date: 2019-11-19
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Publication No.: US11274205B2Publication Date: 2022-03-15
- Inventor: Sang Hwa Lee , Yeong Deuk Seo , Sang Hyun Hong
- Applicant: Lotte Advanced Materials Co., Ltd.
- Applicant Address: KR Yeosu-si
- Assignee: Lotte Advanced Materials Co., Ltd.
- Current Assignee: Lotte Advanced Materials Co., Ltd.
- Current Assignee Address: KR Yeosu-si
- Agency: Additon, Pendleton & Witherspoon, P.A.
- Priority: KR10-2018-0147559 20181126
- Main IPC: C08L77/06
- IPC: C08L77/06 ; B29C48/00 ; C08L33/08 ; C08L77/10 ; B29K77/00 ; C08K3/40
Abstract:
A polyamide resin composition includes an aromatic polyamide resin, an aliphatic polyamide resin, a polyacrylic acid, and glass fibers. The polyamide resin composition can have good properties in terms of heat resistance, long-term heat resistance stability, and/or appearance characteristics.
Public/Granted literature
- US20200165449A1 Polyamide Resin Composition and Article Comprising the Same Public/Granted day:2020-05-28
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