A film forming apparatus for forming a film on a substrate includes a driver configured to bring a curable composition arranged on the substrate and a flat surface into contact with each other, a heater configured to heat the curable composition by electromagnetic waves to reduce the viscosity of the curable composition and make the curable composition conform to the flat surface, and a curing device configured to form a film made of a cured product of the curable composition by curing the curable composition in a state in which the curable composition conforms to the flat surface.