Invention Grant
- Patent Title: Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
-
Application No.: US17115871Application Date: 2020-12-09
-
Publication No.: US11275310B2Publication Date: 2022-03-15
- Inventor: Sho Kawadahara
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2020-036060 20200303
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H01L21/027

Abstract:
In one embodiment, a semiconductor manufacturing apparatus includes a stage on which a substrate is to be installed. The apparatus further includes a light source configured to generate light. The apparatus further includes a shaper including a rotating portion provided with an opening configured to shape the light from the light source, the shaper being configured to irradiate a photomask with the light which has passed through the opening. The apparatus further includes a controller configured to change a width of the light passing through the opening by rotating the rotating portion while scanning the substrate by the light which has passed through the photomask.
Public/Granted literature
- US20210278770A1 SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2021-09-09
Information query
IPC分类: