Invention Grant
- Patent Title: Heat dissipation wall system
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Application No.: US16946643Application Date: 2020-06-30
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Publication No.: US11275414B2Publication Date: 2022-03-15
- Inventor: Derric Christopher Hobbs , Christopher Michael Helberg
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agent Joseph Mencher
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F1/18 ; H05K7/20

Abstract:
A heat dissipation wall system includes a base wall having an outer surface, a plurality of side walls extending approximately perpendicularly from the base wall to define a component housing between the base wall and the side walls, and a plurality of heat dissipation channels defined by the base wall and extending into the base wall from the outer surface. Each of the heat dissipation channels includes a respective first airflow aperture that extends through the base wall from the outer surface to the component housing and that is configured to allow an airflow adjacent the outer surface to enter the component housing, and a respective second airflow aperture that is spaced apart from the first airflow aperture, that extends through the base wall from the outer surface to the component housing, and that is configured to allow an airflow adjacent the outer surface to enter the component housing.
Public/Granted literature
- US20210405717A1 HEAT DISSIPATION WALL SYSTEM Public/Granted day:2021-12-30
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