A dissipating interconnection module for an M.2 form factor expansion card, includes a heat sink, which includes an enclosure including an upper wall for being in thermal contact with the first heat exchange surface of the expansion card and two tabs, each tab for being in thermal contact with the upper wall of the heat sink and for being in thermal contact with the fluid cooling system of the first electronic board, and the upper wall and the two tabs of the enclosure being arranged to form a space in which the expansion card can be received; a mechanical attachment system for removably mechanically attaching the expansion card to the heat sink; an interconnection electronic board including the second M.2 connector, a third electrical connector to be connected to a fourth electrical connector of the first electronic board.