Invention Grant
- Patent Title: Multilayer seed pattern inductor, manufacturing method thereof, and board having the same
-
Application No.: US16200263Application Date: 2018-11-26
-
Publication No.: US11276520B2Publication Date: 2022-03-15
- Inventor: Woon Chui Choi , Ji Hye Oh , Hye Min Bang , Myung Jun Park , Jung Hyuk Jung
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2014-0126205 20140922
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/255 ; H01F5/00 ; H01F17/00 ; H01F17/04 ; H01F41/04 ; H01F27/29
Abstract:
A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.
Public/Granted literature
- US20190096563A1 MULTILAYER SEED PATTERN INDUCTOR, MANUFACTURING METHOD THEREOF, AND BOARD HAVING THE SAME Public/Granted day:2019-03-28
Information query
