Invention Grant
- Patent Title: Multi-zone semiconductor substrate supports
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Application No.: US15597949Application Date: 2017-05-17
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Publication No.: US11276590B2Publication Date: 2022-03-15
- Inventor: Mehmet Tugrul Samir , Dongqing Yang , Dmitry Lubomirsky , Peter Hillman , Soonam Park , Martin Yue Choy , Lala Zhu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01J37/32
Abstract:
Exemplary support assemblies may include a top puck and a backing plate coupled with the top puck. The support assemblies may include a cooling plate coupled with the backing plate. The support assemblies may include a heater coupled between the cooling plate and the backing plate. The support assemblies may also include a back plate coupled with the backing plate about an exterior of the backing plate. The back plate may at least partially define a volume, and the heater and the cooling plate may be housed within the volume.
Public/Granted literature
- US20180337074A1 MULTI-ZONE SEMICONDUCTOR SUBSTRATE SUPPORTS Public/Granted day:2018-11-22
Information query
IPC分类:
