Invention Grant
- Patent Title: Transfer method using deformable film
-
Application No.: US16907697Application Date: 2020-06-22
-
Publication No.: US11276603B2Publication Date: 2022-03-15
- Inventor: Je Hyuk Choi , Chang Wan Kim , Chan Soo Shin , Hyeong Ho Park , Shin Keun Kim
- Applicant: LC SQUARE CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: LC SQUARE CO., LTD.
- Current Assignee: LC SQUARE CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Burris Law, PLLC
- Priority: KR10-2017-0178701 20171222
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L23/00 ; H01L25/075 ; H01L25/16 ; H01L33/00

Abstract:
A transfer method of transferring an object to a target substrate by using a deformable film is provided. The method includes: a first process of forming an object on a source substrate, a second process of placing a deformable film on the source substrate on which the object is formed, a third process of embedding the object into the deformable film, a fourth process of separating an object, which is to be transferred, from the source substrate, integrating the transfer object in or on a surface of the deformable film, and separating deformable film, in which the transfer object is integrated, from the source substrate, and a fifth process of transferring the object integrated into the deformable film to a target substrate.
Public/Granted literature
- US20200321234A1 TRANSFER METHOD USING DEFORMABLE FILM Public/Granted day:2020-10-08
Information query
IPC分类: