Invention Grant
- Patent Title: Laser reflow apparatus and method for electronic components with micron-class thickness
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Application No.: US16546600Application Date: 2019-08-21
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Publication No.: US11276665B2Publication Date: 2022-03-15
- Inventor: Nam Seong Kim , Jae Joon Choi
- Applicant: LASERSSEL CO., LTD.
- Applicant Address: KR Asan-si
- Assignee: LASERSSEL CO., LTD.
- Current Assignee: LASERSSEL CO., LTD.
- Current Assignee Address: KR Asan-si
- Agency: Hauptman Ham, LLP
- Priority: KR10-2018-0111572 20180918
- Main IPC: B23K26/03
- IPC: B23K26/03 ; B23K26/06 ; H01L23/00 ; B23K26/354 ; H01L21/66 ; B23K1/005 ; B23K26/073 ; B23K3/00

Abstract:
Provided is a laser reflow apparatus for reflowing electronic components on a substrate disposed on a stage, the apparatus including: a laser emission unit comprised of a plurality of laser modules for emitting a laser beam having a flat top output profile in at least one section of the substrate on which the electronic components are disposed; a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components performed by the laser beam; and a laser output control unit configured to generate a control signal for independently controlling the respective laser modules of the laser emission unit based on a signal output from the camera unit and apply the control signal to the laser emission unit.
Public/Granted literature
- US20200091108A1 Laser reflow apparatus and method for electronic components with micron-class thickness Public/Granted day:2020-03-19
Information query
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