Invention Grant
- Patent Title: Optical package
-
Application No.: US16670836Application Date: 2019-10-31
-
Publication No.: US11276720B2Publication Date: 2022-03-15
- Inventor: Shih-Chieh Tang , Lu-Ming Lai , Chia Yun Hsu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An optical package includes a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.
Public/Granted literature
- US20210134857A1 OPTICAL PACKAGE Public/Granted day:2021-05-06
Information query
IPC分类: