Invention Grant
- Patent Title: Imaging element, stacked imaging element, and solid-state imaging apparatus
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Application No.: US16499917Application Date: 2018-04-17
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Publication No.: US11276726B2Publication Date: 2022-03-15
- Inventor: Toshiki Moriwaki , Yukio Kaneda
- Applicant: SONY CORPORATION , SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Tokyo; JP Kanagawa
- Assignee: SONY CORPORATION,SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY CORPORATION,SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Tokyo; JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JPJP2017-084495 20170421,JPJP2017-157157 20170816
- International Application: PCT/JP2018/015838 WO 20180417
- International Announcement: WO2018/194051 WO 20181025
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An imaging element includes a photoelectric conversion unit including a first electrode, a photoelectric conversion layer, and a second electrode that are stacked, in which an inorganic oxide semiconductor material layer is formed between the first electrode and the photoelectric conversion layer, and the inorganic oxide semiconductor material layer includes at least two types of elements selected from the group consisting of indium, tungsten, tin, and zinc. Alternatively, a LUMO value E1 of a material included in a part of the photoelectric conversion layer positioned near the inorganic oxide semiconductor material layer and a LUMO value E2 of a material included in the inorganic oxide semiconductor material layer satisfy E1-E2
Information query
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