Method and apparatus for multiple physical layer interfaces within a single connector

Invention Grant

US11277297B2 Method and apparatus for multiple physical layer interfaces within a single connector 有权

Please log in to see more content

Patent Title: Method and apparatus for multiple physical layer interfaces within a single connector
Application No.: US16596504

Application Date: 2019-10-08
Publication No.: US11277297B2

Publication Date: 2022-03-15
Inventor: Thomas Jeffrey Bingel , Deanne Tran Vo
Applicant: Honeywell International Inc.
Applicant Address: US NJ Morris Plains
Assignee: Honeywell International Inc.
Current Assignee: Honeywell International Inc.
Current Assignee Address: US NJ Morris Plains
Agency: Alston & Bird LLP
Main IPC: H04L29/08
IPC: H04L29/08 ; H04L69/323 ; H04L12/40

Method and apparatus for multiple physical layer interfaces within a single connector

Abstract:

Apparatuses and methods for configuration and operation of data communication connectors supporting connectivity to various physical interfaces are provided.

Public/Granted literature

US20210105170A1 METHOD AND APPARATUS FOR MULTIPLE PHYSICAL LAYER INTERFACES WITHIN A SINGLE CONNECTOR Public/Granted day:2021-04-08

Information query

Espacenet