Invention Grant
- Patent Title: Transdermal microneedle array patch
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Application No.: US15939772Application Date: 2018-03-29
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Publication No.: US11278217B2Publication Date: 2022-03-22
- Inventor: Jung-Tang Huang , Kuan-Ting Lee , Dahong Qian
- Applicant: RichHealth Technology Corporation , Richtek Technology Corporation
- Applicant Address: TW Zhubei; TW Chupei
- Assignee: RichHealth Technology Corporation,Richtek Technology Corporation
- Current Assignee: RichHealth Technology Corporation,Richtek Technology Corporation
- Current Assignee Address: TW Zhubei; TW Chupei
- Agency: Behmke Innovation Group
- Agent James M. Behmke; Jonathon P. Western
- Priority: TW107107686 20180307
- Main IPC: A61B5/145
- IPC: A61B5/145 ; A61B5/15 ; A61B5/1486 ; A61B5/00 ; A61M37/00

Abstract:
Provided is a transdermal microneedle array patch, including: a bottom cover; a top cover; a substrate disposed within the top cover; and a first probe and a second probe disposed between the bottom cover and the top cover and electrically connected the substrate. The first and second probes form an open circuit. While the bottom cover is combined with the top cover to form the transdermal microneedle array patch, the first and second probes form a closed circuit.
Public/Granted literature
- US20180279929A1 TRANSDERMAL MICRONEEDLE ARRAY PATCH Public/Granted day:2018-10-04
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