Invention Grant
- Patent Title: Method and devices for intracorporeal bonding of implants with thermal energy
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Application No.: US16560771Application Date: 2019-09-04
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Publication No.: US11278331B2Publication Date: 2022-03-22
- Inventor: Peter M. Bonutti , Matthew J. Cremens , Justin E. Beyers
- Applicant: P Tech, LLC
- Applicant Address: US IL Effingham
- Assignee: P Tech, LLC
- Current Assignee: P Tech, LLC
- Current Assignee Address: US IL Effingham
- Agency: Stinson LLP
- Main IPC: A61B17/70
- IPC: A61B17/70 ; A61B17/72 ; A61B17/80 ; A61B17/82 ; G06F21/10 ; A61B17/68 ; A61B17/86 ; A61B17/88 ; A61F2/40 ; A61B17/04 ; A61B17/17 ; A61B17/11 ; A61B17/00 ; A61F2/30 ; A61F2/32 ; A61F2/36 ; A61F2/38 ; A61F2/42 ; A61F2/44 ; A61F2/46 ; A61F2/28 ; A61F2/34 ; A61F2/82 ; A61B17/32

Abstract:
The present invention provides a method for stabilizing a fractured bone. The method includes positioning an elongate rod in the medullary canal of the fractured bone and forming a passageway through the cortex of the bone. The passageway extends from the exterior surface of the bone to the medullary canal of the bone. The method also includes creating a bonding region on the elongate rod. The bonding region generally aligned with the passageway of the cortex. Furthermore, the method includes positioning a fastener in the passageway of the cortex and on the bonding region of the elongate rod and thermally bonding the fastener to the bonding region of the elongate rod while the fastener is positioned in the passageway of the cortex.
Public/Granted literature
- US20200214747A1 Method and Devices for Intracorporeal Bonding of Implants with Thermal Energy Public/Granted day:2020-07-09
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