Invention Grant
- Patent Title: Chip to chip fluidic interconnect
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Application No.: US16494856Application Date: 2017-04-21
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Publication No.: US11278892B2Publication Date: 2022-03-22
- Inventor: Michael W. Cumbie , Viktor Shkolnikov , Chien-Hua Chen
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Thorpe North & Western LLP
- International Application: PCT/US2017/028744 WO 20170421
- International Announcement: WO2018/194635 WO 20181025
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B01L7/00 ; G01N35/00 ; G01N35/10

Abstract:
A device may include a substrate, a first fluid processing chip, a second fluid processing chip, a tapered channel, and a fluid actuator. The first fluid processing chip may be disposed on the substrate and may process a micro-volume of fluid. The second fluid processing chip may be disposed on the substrate and co-planar with the first fluid processing chip. The second fluid processing chip may process at least a portion of the micro-volume of fluid. The tapered channel may be disposed between the first and second fluid processing chips to transport the at least the portion of the micro-volume of fluid from the first fluid processing chip to the second fluid processing chip. The fluid actuator may be disposed proximate to the tapered channel and may control movement of the at least the portion of the micro-volume of fluid within the tapered channel.
Public/Granted literature
- US20200094247A1 CHIP TO CHIP FLUIDIC INTERCONNECT Public/Granted day:2020-03-26
Information query
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