Invention Grant
- Patent Title: Staple removing device
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Application No.: US16327183Application Date: 2017-09-21
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Publication No.: US11279015B2Publication Date: 2022-03-22
- Inventor: Katsuya Hakozaki , Tooru Yoshie , Tomokazu Matsui
- Applicant: MAX CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: MAX CO., LTD.
- Current Assignee: MAX CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Weihrouch IP
- Priority: JPJP2016-185910 20160923
- International Application: PCT/JP2017/034120 WO 20170921
- International Announcement: WO2018/056360 WO 20180329
- Main IPC: B66F15/00
- IPC: B66F15/00 ; B25C11/00 ; B65H3/00

Abstract:
A staple removing device configured to remove a staple of a paper bundle bound by the staple includes a loading portion on which the paper bundle is loaded and a pressing member (120A) configured to press the paper bundle to the loading portion. The pressing member (120A) includes a staple support portion (126) configured to position the staple at a removing position at which the staple abuts against the staple support portion (126).
Public/Granted literature
- US20190184537A1 STAPLE REMOVING DEVICE Public/Granted day:2019-06-20
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