Invention Grant
- Patent Title: Heat shield assembly and method
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Application No.: US16546631Application Date: 2019-08-21
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Publication No.: US11279462B2Publication Date: 2022-03-22
- Inventor: Thomas J. Connelly , Linda M. Li
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Walters & Wasylyna LLC
- Main IPC: B64C3/36
- IPC: B64C3/36 ; B64C1/40 ; B64D29/02 ; B64C1/12 ; B64D27/26 ; B64F5/10
Abstract:
A method for stiffening a skin panel of a heat shield assembly comprises steps of forming a blank into a stiffener, which includes a base portion and a bead portion that protrudes from the base portion, and connects the base portion to the skin panel.
Public/Granted literature
- US20200062375A1 HEAT SHIELD ASSEMBLY AND METHOD Public/Granted day:2020-02-27
Information query
