Invention Grant
- Patent Title: Lid packing material for food container
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Application No.: US17139745Application Date: 2020-12-31
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Publication No.: US11279538B2Publication Date: 2022-03-22
- Inventor: Jin Seok Choi , Sung Ji Choi
- Applicant: DONGWON SYSTEMS CORPORATION
- Applicant Address: KR Gyeonggi-do
- Assignee: DONGWON SYSTEMS CORPORATION
- Current Assignee: DONGWON SYSTEMS CORPORATION
- Current Assignee Address: KR Gyeonggi-do
- Agency: Hodgson Russ LLP
- Priority: KR10-2020-0012019 20200131
- Main IPC: B65D65/42
- IPC: B65D65/42 ; B32B3/12 ; B32B3/14 ; B32B7/14 ; B32B27/08 ; B32B27/36

Abstract:
The example embodiments relate to a lid packing material for food container, and a lid packing material for food container according to an aspect of the example embodiments includes: a substrate layer; and a heat-adhesion layer formed on the substrate layer, wherein the heat-adhesion layer includes at least two types of wax having different melting points.
Public/Granted literature
- US20210237950A1 LID PACKING MATERIAL FOR FOOD CONTAINER Public/Granted day:2021-08-05
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