Invention Grant
- Patent Title: Adhesive tape
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Application No.: US16615728Application Date: 2017-05-23
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Publication No.: US11279857B2Publication Date: 2022-03-22
- Inventor: Takashi Edahiro
- Applicant: TERAOKA SEISAKUSHO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TERAOKA SEISAKUSHO CO., LTD.
- Current Assignee: TERAOKA SEISAKUSHO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- International Application: PCT/JP2017/019249 WO 20170523
- International Announcement: WO2018/216114 WO 20181129
- Main IPC: B32B7/02
- IPC: B32B7/02 ; C09J7/25 ; C09J7/30

Abstract:
A thin adhesive tape includes a base and an adhesive layer provided on one surface of the base, wherein the base has a thickness of 2 to 25 μm, the adhesive layer has a thickness of 0.1 to 10 μm, the adhesive tape has a thickness of 30 μm or less, the adhesive tape has a peel adhesion of 0.50 N/10 mm or more in accordance with JIS Z 0237:2000, and the adhesive tape has a strength to repel members calculated by the following formula of 70 MPa·mm or less, the adhesive tape being excellent in a balance between fixability of members and followability to members: Strength to repel members (MPa·mm)=tensile elastic modulus (MPa) of adhesive tape×thickness (mm) of adhesive tape.
Public/Granted literature
- US20200208017A1 ADHESIVE TAPE Public/Granted day:2020-07-02
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