A curable adhesive that is particularly well suited for use in an injection or compression molding operation. The adhesive is based on polymeric resins having carboxylic acid and acrylate ester functionality, such as grafted phenoxy resin, and further constituents such as organic carbonates, blocked isocyanates, catalysts, maleimide compounds, hydride sources, and a carrier fluid. The curable adhesives are particularly well suited for bonding liquid injectable substrates such as liquid silicone rubber, or polyamides to rigid substrates, such as aluminum, stainless steel, or glass.