Invention Grant
- Patent Title: Fluorine resin molded body
-
Application No.: US16917974Application Date: 2020-07-01
-
Publication No.: US11280421B2Publication Date: 2022-03-22
- Inventor: Yoshitada Doi , Yuzuru Okita , Keisuke Ikeda
- Applicant: SMC CORPORATION
- Applicant Address: JP Chiyoda-ku
- Assignee: SMC CORPORATION
- Current Assignee: SMC CORPORATION
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2019-125692 20190705
- Main IPC: F16K25/00
- IPC: F16K25/00 ; F16K7/14 ; F16J15/10 ; F16J15/06

Abstract:
In a fluorine resin molded body employed in a fluid device and including a ring-shaped seal section, the seal section is configured from a projection and a backup section that are aligned in a direction in which the seal section receives a compressive load when the fluorine resin molded body is installed in the fluid device.
Public/Granted literature
- US20210003228A1 FLUORINE RESIN MOLDED BODY Public/Granted day:2021-01-07
Information query