A flow sensor configured to detect a fluid flow of a liquid inside a pipe portion is disclosed. A thin film thermal mass flow sensor has a substrate defining a thickness from an upper side opposite a bottom side. The upper side of the substrate supports a resistive heating circuit, a first temperature sensor circuit and a second temperature sensor circuit. The resistive heating circuit is disposed between the first and second temperature sensor circuits. The circuits are electrically connected respectively to a plurality of leadwires configured to be attachable to electronic equipment. A thermally conductive membrane is configured to separate the fluid flow of the liquid inside the pipe portion from the thin film thermal mass flow sensor. A thermally conductive bond connects the bottom side of the substrate of the thin film thermal mass flow sensor to the thermally conductive membrane.