Invention Grant
- Patent Title: Thermal control of a probe card assembly
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Application No.: US15056789Application Date: 2016-02-29
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Publication No.: US11280827B2Publication Date: 2022-03-22
- Inventor: Kevin A. Thompson , Isaac N Silva
- Applicant: Teradyne, Inc.
- Applicant Address: US MA North Reading
- Assignee: Teradyne, Inc.
- Current Assignee: Teradyne, Inc.
- Current Assignee Address: US MA North Reading
- Agency: Burns & Levinson LLP
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to the probe card, and a heater to heat to at least part of the probe card assembly. A prober is configured to move a device under test (DUT) into contact with the electrical contacts of the probe card assembly.
Public/Granted literature
- US20170248632A1 THERMAL CONTROL OF A PROBE CARD ASSEMBLY Public/Granted day:2017-08-31
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