Invention Grant
- Patent Title: Apparatus for sensing and three dimensional haptic
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Application No.: US16724014Application Date: 2019-12-20
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Publication No.: US11281295B2Publication Date: 2022-03-22
- Inventor: Seow Yuen Yee , Christian Peters , Thomas Rocznik , Ning Wang , Timothy Schultz , Gary Yama
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Dickinson Wright PLLC
- Main IPC: G06F3/01
- IPC: G06F3/01 ; G06F3/041 ; G06F3/044 ; B60W50/16

Abstract:
A transducer includes one or more actuator components configured to be encompassed by a cavity of a frame, wherein the one or more actuator components are configured to allow in-plane and out-of-plane movement with respect to the frame and configured to create haptic feedback in the in-plane or out-of-plane movement to the frame. The transducer also includes one or more sensing layers configured to detect changes of displacement in the frame, wherein the sensing layer is connected to the one or more actuator components.
Public/Granted literature
- US20210191515A1 APPARATUS FOR SENSING AND THREE DIMENSIONAL HAPTIC Public/Granted day:2021-06-24
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