Invention Grant
- Patent Title: Cell layout and structure
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Application No.: US16860714Application Date: 2020-04-28
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Publication No.: US11281835B2Publication Date: 2022-03-22
- Inventor: Tung-Heng Hsieh , Sheng-Hsiung Wang , Hui-Zhong Zhuang , Yu-Cheng Yeh , Tsung-Chieh Tsai , Juing-Yi Wu , Liang-Yao Lee , Jyh-Kang Ting
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: G06F30/392
- IPC: G06F30/392 ; G06F30/394 ; G06F30/398 ; H01L27/02 ; H01L27/118

Abstract:
A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.
Public/Granted literature
- US20200257842A1 Cell Layout and Structure Public/Granted day:2020-08-13
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