Invention Grant
- Patent Title: Circuit assembly
-
Application No.: US16081753Application Date: 2017-03-08
-
Publication No.: US11289261B2Publication Date: 2022-03-29
- Inventor: Toshiyuki Tsuchida , Shigeki Yamane , Hirotoshi Maeda , Takuya Ota , Junya Aichi
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LIMITED , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Yokkaichi; JP Yokkaichi; JP Osaka
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LIMITED,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LIMITED,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Yokkaichi; JP Yokkaichi; JP Osaka
- Agency: Oliff PLC
- Priority: JPJP2016-045283 20160309
- International Application: PCT/JP2017/009159 WO 20170308
- International Announcement: WO2017/154954 WO 20170914
- Main IPC: H01F27/02
- IPC: H01F27/02 ; H01F27/06 ; H01F27/08 ; H01F17/04 ; H01F27/28 ; H01F27/30 ; H05K1/02 ; H05K3/32

Abstract:
A circuit assembly that includes an inductor including a core; a fixation member to which the inductor is fixed; a base that is attached to the core, wherein: the fixation member is made of a first material having a coefficient of thermal expansion larger than a coefficient of thermal expansion of the core, and the base is made of a second material having a coefficient of thermal expansion larger than the coefficient of thermal expansion of the core and smaller than the coefficient of thermal expansion of the fixation member; and an adhesive layer that is disposed between the base and the fixation member, and that bonds the base and the fixation member together.
Public/Granted literature
- US20190206604A1 CIRCUIT ASSEMBLY Public/Granted day:2019-07-04
Information query