Invention Grant
- Patent Title: Electronic chip package
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Application No.: US16802325Application Date: 2020-02-26
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Publication No.: US11289391B2Publication Date: 2022-03-29
- Inventor: Olivier Ory
- Applicant: STMICROELECTRONICS (TOURS) SAS
- Applicant Address: FR Tours
- Assignee: STMICROELECTRONICS (TOURS) SAS
- Current Assignee: STMICROELECTRONICS (TOURS) SAS
- Current Assignee Address: FR Tours
- Priority: FR1902000 20190227
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/3205 ; H01L21/56 ; H01L21/78 ; H01L29/861
Abstract:
A device comprising a semiconductor substrate, an electrically-conductive layer covering the substrate, and an insulating sheath, the conductive layer being in contact with the insulating sheath on the side opposite to the substrate.
Public/Granted literature
- US20200273767A1 ELECTRONIC CHIP PACKAGE Public/Granted day:2020-08-27
Information query
IPC分类:
