A semiconductor device according to one embodiment includes a first leadframe, a second leadframe, a semiconductor chip, and a conductive member. The second leadframe has a first face provided with a recess and is separated from the first leadframe. The semiconductor chip is mounted on the first leadframe. The conductive member has a second face connected to the first face with a conductive adhesive, the second face provided with a protrusion housed in the recess at least partially, and the conductive member electrically connected the semiconductor chip and the second leadframe to each other. The recess and the protrusion are longer in a first direction in which the first face extends than in a second direction along the first face and orthogonal to the first direction.