Invention Grant
- Patent Title: Fan-out antenna packaging structure and packaging method
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Application No.: US16992016Application Date: 2020-08-12
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Publication No.: US11289435B2Publication Date: 2022-03-29
- Inventor: Yenheng Chen , Chengchung Lin , Chengtar Wu
- Applicant: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Applicant Address: CN Jiang Yin
- Assignee: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Current Assignee: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Current Assignee Address: CN Jiang Yin
- Agency: Alston & Bird LLP
- Priority: CN201810949023.5 20180820,CN201821346487.9 20180820
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/00 ; H01Q1/24 ; H01L23/538

Abstract:
The present disclosure provides a fan-out antenna packaging structure for a semiconductor chip and its fabricating method. The structure is a stacked-up two sets of metal connecting columns and antenna metal patterns arranged in two sequential layers of packaging materials. In some applications there can be more than two sets of the stacked-up antenna structures, fabricated around the chip at one side of a rewiring layer. The chip is interconnected to external metal bumps on the other side of the rewiring layer.
Public/Granted literature
- US20200373263A1 FAN-OUT ANTENNA PACKAGING STRUCTURE AND PACKAGING METHOD Public/Granted day:2020-11-26
Information query
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