Invention Grant
- Patent Title: Method and device for controlling operation using temperature deviation in multi-chip package
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Application No.: US17002557Application Date: 2020-08-25
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Publication No.: US11289457B2Publication Date: 2022-03-29
- Inventor: Min-Sang Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2015-0049952 20150408
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/34 ; G06F13/00 ; G11C11/406 ; H01L25/18 ; H01L23/00
Abstract:
A multi-chip package includes a first die having temperature sensors and a second die. The first die generates temperature deviation information of m (m
Information query
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