Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17132699Application Date: 2020-12-23
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Publication No.: US11289473B2Publication Date: 2022-03-29
- Inventor: Kiseok Lee , Chan-Sic Yoon , Dongoh Kim , Myeong-Dong Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2018-0047410 20180424
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L27/06 ; H01L21/8238 ; H01L21/768 ; H01L29/78 ; H01L29/66 ; H01L29/49 ; H01L27/24 ; H01L27/108 ; H01L27/22

Abstract:
Disclosed is a semiconductor device comprising a substrate including a first region and a second region, a first gate pattern on the substrate of the first region, and a second gate pattern on the substrate of the second region. The first gate pattern comprises a first high-k dielectric pattern, a first N-type metal-containing pattern, and a first P-type metal-containing pattern that are sequentially stacked. The second gate pattern comprises a second high-k dielectric pattern and a second P-type metal-containing pattern that are sequentially stacked.
Public/Granted literature
- US20210125980A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-04-29
Information query
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