Invention Grant
- Patent Title: Method for manufacturing insulated gate field effect transistor
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Application No.: US16668867Application Date: 2019-10-30
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Publication No.: US11289581B2Publication Date: 2022-03-29
- Inventor: Fumiaki Okazaki
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2007-035007 20070215
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L21/28 ; H01L21/768 ; H01L29/51 ; H01L29/66 ; H01L29/78

Abstract:
An insulated gate field effect transistor with (a) a base having source/drain regions, a channel forming region, a gate insulating film formed on the channel forming region, an insulating layer covering the source/drain regions, and a gate electrode formation opening provided in a partial portion of the insulating layer above the channel forming region; (b) a gate electrode formed by burying a conducive material layer in the gate electrode formation opening; (c) a first interlayer insulating layer formed on the insulating layer and the gate electrode and containing no oxygen atom as a constituent element; and (d) a second interlayer insulating layer on the first interlayer insulating layer.
Public/Granted literature
- US20200066863A1 METHOD FOR MANUFACTURING INSULATED GATE FIELD EFFECT TRANSISTOR Public/Granted day:2020-02-27
Information query
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