Invention Grant
- Patent Title: GaN-based superjunction vertical power transistor and manufacturing method thereof
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Application No.: US16635323Application Date: 2019-03-14
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Publication No.: US11289594B2Publication Date: 2022-03-29
- Inventor: Sen Huang , Xinhua Wang , Xinyu Liu , Yuankun Wang , Haibo Yin , Ke Wei
- Applicant: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Applicant Address: CN Beijing
- Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee Address: CN Beijing
- Agency: Pillsbury Withrop Shaw Pittman LLP
- International Application: PCT/CN2019/078113 WO 20190314
- International Announcement: WO2020/181548 WO 20200917
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/06 ; H01L29/20 ; H01L29/205 ; H01L29/66

Abstract:
A GaN-based superjunction vertical power transistor and a manufacturing method thereof. The transistor includes: a N−-GaN layer; a first P-GaN layer as a current blocking layer, formed on the N−-GaN layer and having a gate region window; and a thin barrier Al(In, Ga)N/GaN heterostructure conformally formed on the current blocking layer and filling the bottom and one or more sidewalls of the gate region window, wherein the N−-GaN layer has an etched groove completely or partially filled with a second P-type GaN layer, an N+-GaN layer is formed under the second P-type GaN layer, and the N+-GaN layer is in direct contact with the second P-type GaN layer and the N−-GaN layer to form a superjunction composite structure.
Public/Granted literature
- US20210399125A1 GaN-BASED SUPERJUNCTION VERTICAL POWER TRANSISTOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-12-23
Information query
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