Invention Grant
- Patent Title: Resistive random access memory device
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Application No.: US15788690Application Date: 2017-10-19
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Publication No.: US11289647B2Publication Date: 2022-03-29
- Inventor: Chun-Chieh Mo , Shih-Chi Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
A memory cell includes: a first electrode; a resistive material layer comprising one horizontal portion and two vertical portions that are respectively coupled to ends of the horizontal portion; and a second electrode, wherein the second electrode is partially surrounded by a top boundary of the U-shaped profile and the first electrode extends along part of a bottom boundary of the U-shaped profile.
Public/Granted literature
- US20190123269A1 NOVEL RESISTIVE RANDOM ACCESS MEMORY DEVICE Public/Granted day:2019-04-25
Information query
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