Invention Grant
- Patent Title: Circuit board arrangement for signal supply to a radiator
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Application No.: US16307442Application Date: 2017-06-06
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Publication No.: US11289796B2Publication Date: 2022-03-29
- Inventor: Andreas Vollmer , Dan Fleancu
- Applicant: Telefonaktiebolaget LM Ericsson (publ)
- Applicant Address: SE Stockholm
- Assignee: Telefonaktiebolaget LM Ericsson (publ)
- Current Assignee: Telefonaktiebolaget LM Ericsson (publ)
- Current Assignee Address: SE Stockholm
- Agency: Withrow & Terranova, PLLC
- Priority: DE102016007052.8 20160606
- International Application: PCT/EP2017/000656 WO 20170606
- International Announcement: WO2017/211451 WO 20171214
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q21/06 ; H01Q9/06 ; H01Q1/38 ; H01P5/08 ; H01P5/12 ; H05K1/02 ; H01Q19/10 ; H04W88/04 ; H05K1/11 ; H01Q21/00

Abstract:
The present invention relates to a circuit board arrangement including a circuit board, whose metallization comprises at least one coplanar stripline for supplying signals to a radiator, in particular a mobile communication radiator. In this circuit board arrangement, the circuit board comprises a field converter, which is electrically connected to the coplanar stripline and which conducts a coaxial field through at least one layer of the circuit board and converts it into the coplanar stripline field of the coplanar stripline.
Public/Granted literature
- US20190221918A1 CIRCUIT BOARD ARRANGEMENT FOR SIGNAL SUPPLY TO A RADIATOR Public/Granted day:2019-07-18
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