Invention Grant
- Patent Title: Electric wire connection structure and connection method
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Application No.: US17171855Application Date: 2021-02-09
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Publication No.: US11289826B2Publication Date: 2022-03-29
- Inventor: Hideki Adachi
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JPJP2020-020624 20200210
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01R4/18 ; H01R4/02 ; H01R11/11 ; H01R25/16

Abstract:
A connection structure for an electric wire includes an electric wire that has a conductor and an outer sheath covering the conductor; a bonding member that is made of a conductive metal material and is attached to the electric wire and; and a busbar that is made of a conductive metal material and on which the bonding member is overlapped and ultrasonically bonded with the conductor interposed between the busbar and the bonding member. The bonding member includes a crimping portion for crimping and fixing the electric wire.
Public/Granted literature
- US20210249796A1 ELECTRIC WIRE CONNECTION STRUCTURE AND CONNECTION METHOD Public/Granted day:2021-08-12
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