Invention Grant
- Patent Title: Microphone assembly
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Application No.: US16524195Application Date: 2019-07-29
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Publication No.: US11290798B2Publication Date: 2022-03-29
- Inventor: Guixia Yang , Changjin Ma , Jianwei Chen
- Applicant: AAC Technologies Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: AAC Technologies Pte. Ltd.
- Current Assignee: AAC Technologies Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: W&G Law Group
- Priority: CN201821242883.7 20180802
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/08 ; H05K1/02 ; H05K1/18 ; H05K1/14 ; H01R12/78

Abstract:
A microphone assembly includes a circuit board and a microphone array disposed on the circuit board. The circuit board includes: a first FPC extending along a first direction, and a second FPC extending along a second direction different from the first direction and separated from the first FPC, the second FPC and the first FPC are fixed to each other and form an electrical connection, and the microphone array is disposed on the first FPC.
Public/Granted literature
- US20200045400A1 MICROPHONE ASSEMBLY Public/Granted day:2020-02-06
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