Invention Grant
- Patent Title: Adhesive wafer with an integrated release layer
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Application No.: US16486499Application Date: 2018-02-20
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Publication No.: US11291578B2Publication Date: 2022-04-05
- Inventor: Anders Grove Sund , Esben Stroebech , Philip Holler Langhorn , Carsten Sletten , Michael Hoejstroem
- Applicant: Coloplast A/S
- Applicant Address: DK Humlebaek
- Assignee: Coloplast A/S
- Current Assignee: Coloplast A/S
- Current Assignee Address: DK Humlebaek
- Agency: Coloplast Corp., Coloplast A/S
- Agent Nick Baumann
- Priority: DKPA201770117 20170220
- International Application: PCT/DK2018/050034 WO 20180220
- International Announcement: WO2018/149463 WO 20180823
- Main IPC: A61F5/44
- IPC: A61F5/44 ; A61F5/443
Abstract:
An adhesive wafer for an ostomy device, the wafer comprising a first adhesive layer, a backing layer on the distal side of the first adhesive layer, a second skin facing adhesive layer and a hole for accommodating a stoma. Embedded between the adhesive layers is a release layer capable of releasing a neutralizing compound to the peristomal skin.
Public/Granted literature
- US20210275342A1 An Adhesive Wafer with an Integrated Release Layer Public/Granted day:2021-09-09
Information query
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