Invention Grant
- Patent Title: Method for cleaning gas supply line and processing system
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Application No.: US16393462Application Date: 2019-04-24
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Publication No.: US11292035B2Publication Date: 2022-04-05
- Inventor: Risako Matsuda
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Weihrouch IP
- Priority: JPJP2018-084251 20180425
- Main IPC: B08B9/02
- IPC: B08B9/02 ; B08B7/00 ; H01J37/32 ; H01L21/311 ; H01L21/027 ; B08B9/027

Abstract:
A method includes forming a film of a compound on an inner wall of a gas supply line by polymerization of a first compound and a second compound by controlling a temperature of the gas supply line to a first temperature at which the first compound and the second compound are polymerized in a state where a first gas containing the first compound and a second gas containing the second compound are supplied to the gas supply line, and removing the film by controlling the temperature of the gas supply line to a second temperature at which the film is depolymerized after predetermined processing is performed on a target object in a processing chamber by a processing gas supplied into the processing chamber through the gas supply line having the film. The first compound is isocyanate. The second compound is amine or a compound having a hydroxyl group.
Public/Granted literature
- US20190333742A1 METHOD FOR CLEANING GAS SUPPLY LINE AND PROCESSING SYSTEM Public/Granted day:2019-10-31
Information query
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