Invention Grant
- Patent Title: Soldering system with monitoring unit
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Application No.: US16622724Application Date: 2018-07-02
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Publication No.: US11292069B2Publication Date: 2022-04-05
- Inventor: Michael Schaefer
- Applicant: ERSA GmbH
- Applicant Address: DE Wertheim
- Assignee: ERSA GmbH
- Current Assignee: ERSA GmbH
- Current Assignee Address: DE Wertheim
- Agency: Bond Schoeneck & King, PLLC
- Agent George McGuire
- Priority: DE102017115534.1 20170711
- International Application: PCT/EP2018/067751 WO 20180702
- International Announcement: WO2019/011687 WO 20190117
- Main IPC: B23K3/00
- IPC: B23K3/00 ; B23K3/06 ; B23K1/08 ; B23K1/20
Abstract:
The invention relates to a soldering system and a method for wave soldering, having at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle.
Information query
