Invention Grant
- Patent Title: Laminated sheet and electronic component packaging container molded using same
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Application No.: US16954340Application Date: 2019-01-23
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Publication No.: US11292233B2Publication Date: 2022-04-05
- Inventor: Ryosuke Yanaka , Yusuke Masuda
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-009769 20180124
- International Application: PCT/JP2019/002050 WO 20190123
- International Announcement: WO2019/146630 WO 20190801
- Main IPC: B32B25/04
- IPC: B32B25/04 ; C08F220/14 ; C08F212/08 ; C08F236/06 ; B32B25/16 ; B65D65/40 ; H01L21/683 ; H05K13/00

Abstract:
A laminated sheet with a cover material, an adhesive cover tape, and an electronic component packaging container molded. A laminated sheet having a surface layer on both sides of a substrate layer, and the substrate layer includes 30 to 70 mass % of a component mentioned below, 70 to 30 mass % of a component mentioned below, and 0 to 30 mass % of a recycled material of the laminated sheet to the total mass of the substrate layer. The component is a rubber modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer having a conjugated diene rubber component content of 5 to 15 mass %. The component is a vinyl aromatic hydrocarbon-conjugated diene block copolymer containing 15 to 30 mass % of monomeric units derived from conjugated dienes. The component is at least one polymer selected from the group consisting of a vinyl aromatic hydrocarbon polymer and a rubber modified vinyl aromatic hydrocarbon polymer.
Public/Granted literature
- US20210162721A1 LAMINATED SHEET AND ELECTRONIC COMPONENT PACKAGING CONTAINER MOLDED USING SAME Public/Granted day:2021-06-03
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