Invention Grant
- Patent Title: 3-D packaging and shipping based on aggregate data
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Application No.: US15594640Application Date: 2017-05-14
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Publication No.: US11292241B2Publication Date: 2022-04-05
- Inventor: Shay C. Colson , David A. Divine , David S. Thompson
- Applicant: Shay C. Colson , David A. Divine , David S. Thompson
- Applicant Address: US WA Bellingham; US WA Spokane; US WA Spokane
- Assignee: Shay C. Colson,David A. Divine,David S. Thompson
- Current Assignee: Shay C. Colson,David A. Divine,David S. Thompson
- Current Assignee Address: US WA Bellingham; US WA Spokane; US WA Spokane
- Main IPC: B33Y50/00
- IPC: B33Y50/00 ; B33Y10/00 ; B65B57/00 ; B65B5/02
Abstract:
Items may be packaged for shipping or storage using additive manufacturing techniques, also known as three dimensional (3-D) printing. 3-D printed packaging systems of one or more entities may be transmitted to an aggregator and used for, among other things, optimizing shipping and fulfillment of packages.
Public/Granted literature
- US20170341795A1 3-D PACKAGING AND SHIPPING BASED ON AGGREGATE DATA Public/Granted day:2017-11-30
Information query
