Invention Grant
- Patent Title: Liquid discharge head, discharge device, liquid discharge apparatus, and bonded substrate
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Application No.: US17097629Application Date: 2020-11-13
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Publication No.: US11292254B2Publication Date: 2022-04-05
- Inventor: Keishi Miwa , Takahiko Kuroda , Toshiaki Masuda
- Applicant: Ricoh Company, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JPJP2019-216047 20191129
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A liquid discharge head includes a nozzle configured to discharge a liquid, a pressure chamber communicating with the nozzle, a pressure generator configured to apply pressure on the pressure chamber, a first substrate including a terminal electrode connected to the pressure generator, and a second substrate including a bonding surface bonded to the first substrate, the second substrate including a terminal opening exposing the terminal electrode of the first substrate. The first substrate includes a through hole penetrating through the first substrate, and the second substrate includes a communication hole communicating with the through hole of the first substrate and an air communication channel on a surface opposite to the bonding surface, the air communication channel communicating with the terminal opening and the communicating hole.
Public/Granted literature
- US20210162759A1 LIQUID DISCHARGE HEAD, DISCHARGE DEVICE, LIQUID DISCHARGE APPARATUS, AND BONDED SUBSTRATE Public/Granted day:2021-06-03
Information query
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