Invention Grant
- Patent Title: Liquid ejecting head, liquid ejecting apparatus, flow path structure, and method of manufacturing liquid ejecting head
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Application No.: US16907833Application Date: 2020-06-22
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Publication No.: US11292256B2Publication Date: 2022-04-05
- Inventor: Yoshinori Nakajima , Kentaro Murakami , Yoshiki Sugawara , Hiroshige Owaki
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JPJP2019-116436 20190624
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/175

Abstract:
A liquid ejecting head including a nozzle configured to eject a liquid, a liquid flow path communicating with the nozzle, a communication chamber including a communication port configured to communicate with atmospheric air, a partitioning wall portion provided between the liquid flow path and the communication chamber, the partitioning wall portion including an opening portion that communicates the liquid flow path and the communication chamber to each other, and an elastic member closing the opening portion.
Information query
IPC分类: