Invention Grant
- Patent Title: Molded die slivers with exposed front and back surfaces
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Application No.: US16704122Application Date: 2019-12-05
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Publication No.: US11292257B2Publication Date: 2022-04-05
- Inventor: Chien-Hua Chen , Michael W Cumbie
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Crawford Maunu PLLC
- Priority: WOPCT/US2013/033046 20130320,WOPCT/US2013/046065 20130617,WOPCT/US2013/048214 20130627,WOPCT/US2013/052505 20130729,WOPCT/US2013/052512 20130729,WOPCT/US2013/068529 20131105
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14 ; B41J2/045

Abstract:
In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
Public/Granted literature
- US20200180314A1 MOLDED DIE SLIVERS WITH EXPOSED FRONT AND BACK SURFACES Public/Granted day:2020-06-11
Information query
IPC分类: