Conductive structure, method for manufacturing same, and electrode comprising conductive structure

Invention Grant

US11293088B2 Conductive structure, method for manufacturing same, and electrode comprising conductive structure 有权

Patent Title: Conductive structure, method for manufacturing same, and electrode comprising conductive structure
Application No.: US15779835

Application Date: 2016-12-07
Publication No.: US11293088B2

Publication Date: 2022-04-05
Inventor: Ilha Lee , Jin Hyuk Min , Ki-Hwan Kim , Chan Hyoung Park
Applicant: LG CHEM, LTD.
Applicant Address: KR Seoul
Assignee: LG CHEM, LTD.
Current Assignee: LG CHEM, LTD.
Current Assignee Address: KR Seoul
Agency: Dentons US LLP
Priority: KR10-2015-0173536 20151207
International Application: PCT/KR2016/014329 WO 20161207
International Announcement: WO2017/099476 WO 20170615
Main IPC: C23C14/04
IPC: C23C14/04 ; B32B15/08 ; G02B5/00 ; C23C14/08 ; G06F3/041 ; C23C14/20 ; C23C14/34 ; G02F1/1343 ; G03F7/42 ; H01L51/00 ; H01L51/52 ; H01L51/56

Abstract:

The present specification relates to a conductive structure, a method of manufacturing the same, and an electrode including the conductive structure.

Public/Granted literature

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Espacenet

IPC分类:

C	化学；冶金
C23	对金属材料的镀覆；用金属材料对材料的镀覆；表面化学处理；金属材料的扩散处理；真空蒸发法、溅射法、离子注入法或化学气相沉积法的一般镀覆；金属材料腐蚀或积垢的一般抑制
C23C	对金属材料的镀覆；用金属材料对材料的镀覆；表面扩散法，化学转化或置换法的金属材料表面处理；真空蒸发法、溅射法、离子注入法或化学气相沉积法的一般镀覆（挤压法制造包覆金属的产品入B21C23/22；通过将预先存在的薄层连接到制品上的方法用金属进行镀覆处理的见各有关位置，例如B21D39/00，B23K；玻璃的金属化入C03C；砂浆、混凝土、人造石、陶瓷或天然石的金属化入C04B41/00；金属的搪瓷或向金属上镀覆玻璃体层入c23D；用电解法或电泳法处理金属表面或镀覆金属入C25D；单晶膜生长入C30B；纺织品的金属化入D06M11/83；用局部金属化法装饰纺织品入D06Q1/04）
C23C14/00	通过覆层形成材料的真空蒸发、溅射或离子注入进行镀覆
C23C14/04	.局部表面上的镀覆，例如使用掩蔽物