Invention Grant
- Patent Title: 3D printed and combined building wallboard
-
Application No.: US16475368Application Date: 2017-12-26
-
Publication No.: US11293181B2Publication Date: 2022-04-05
- Inventor: Yihe Ma
- Applicant: Yingchuang Building Technique (Shanghai) Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: Yingchuang Building Technique (Shanghai) Co., Ltd.
- Current Assignee: Yingchuang Building Technique (Shanghai) Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: WHGC, P.L.C.
- Agent John F. O'Rourke; Alexander R. Schlee
- Priority: CN201720001657.9 20170103
- International Application: PCT/CN2017/118685 WO 20171226
- International Announcement: WO2018/126951 WO 20180712
- Main IPC: E04C2/288
- IPC: E04C2/288

Abstract:
3D Printed and Combined Building Wallboard (100, 200, 300) including external decorative plate (7), 3D printed external wallboard (1), cement concrete layer (9), 3D printed internal wallboard (2), internal decorative plate (8), and structural reinforcement component (10). Structural reinforcement (10) includes vertical steel reinforcements (5) and horizontal steel reinforcements (11) continuously bent in a convex-concave way along the lengthwise direction. The convex edge and the concave edge of each horizontal reinforcement (11) are respectively located in the wallboard of 3D printed external wallboard (1) and the wallboard of 3D printed internal wallboard (2). External decorative plate (7) is fixed on 3D printed external wallboard (1), internal decorative plate (8) is fixed on 3D printed internal wallboard (2), and the space between 3D printed external wallboard (1) and 3D printed internal wallboard (2) is filled with cement concrete layer (9). Thermal insulation (15) is provided between external wallboard (1) and concrete layer (9), and may be between internal plate (8) and internal wallboard (2).
Public/Granted literature
- US20190338518A1 3D PRINTED AND COMBINED BUILDING WALLBOARD Public/Granted day:2019-11-07
Information query
IPC分类: