Invention Grant
- Patent Title: Cooling device
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Application No.: US17087823Application Date: 2020-11-03
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Publication No.: US11293697B2Publication Date: 2022-04-05
- Inventor: Toshihiro Kitazaki , Naoya Akaishi
- Applicant: TOSHIBA ELECTRO-WAVE PRODUCTS CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: TOSHIBA ELECTRO-WAVE PRODUCTS CO., LTD.
- Current Assignee: TOSHIBA ELECTRO-WAVE PRODUCTS CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2019-229368 20191219
- Main IPC: F28D1/03
- IPC: F28D1/03 ; F28D1/02

Abstract:
According to one embodiment, a cooling device includes a heat releasing element including a surface configured to contact a heat generating element and an internal fluid channel configured to flow a cooling medium. The cooling device also includes a plurality of cooling fins within the fluid channel, each of which extends in a direction crossing a flow direction of the cooling medium and has a zigzag, corrugated shape defined by multiple bent portions.
Public/Granted literature
- US20210190431A1 COOLING DEVICE Public/Granted day:2021-06-24
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